Global Chemical Mechanical Planarization Market was valued US$ XX Bn in 2019 and is expected to grow to US$ XX Bn by 2027, at a CAGR of 6.5% during the forecast period.
Global Chemical Mechanical Planarization MarketThe report study has analyzed revenue impact of COVID-19 pandemic on the sales revenue of market leaders, market followers and market disrupters in the report and same is reflected in our analysis.
Chemical mechanical planarization (CMP) is a process that is used especially for smoothing of surfaces by using both chemical and mechanical forces or to remove topography from silicon oxide, metal and polysilicon surfaces. The process works on the fact that the high points on the surface should be subjected to higher pressure from the pad, when compared to lower points, to improve the removal rates and achieve planarization. Chemical mechanical planarization has numerous applications in the semiconductor industry, such as the manufacture of integrated circuits or chips, compound semiconductors, and many others.
The key players in the global chemical mechanical planarization market are Applied Materials, Inc., Ebara Corporation, DOW Electronic Materials, Hitachi Chemical Company, Ltd. and the other fifteen players are profiled in the report. An in-house study has been made of the global economic conditions & other economic indicators, and factors to assess their respective impact on the market historically, as well as the current impact to make more precise and informed forecasts about the market situation in the future.